Technical Details

• Package / Case 11-WFBGA, FCBGA
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• On-State Resistance (Max) 300mOhm
• -3db Bandwidth 40MHz
• Supplier Device Package 11-FlipChip
• Voltage - Supply, Single (V+) 1.65V ~ 4.8V
• Charge Injection 103pC
• Crosstalk -93dB @ 100kHz
• Switch Circuit SPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Channel-to-Channel Matching (ΔRon) 3mOhm
• Switch Time (Ton, Toff) (Max) 38ns, 17ns
• Channel Capacitance (CS(off), CD(off)) 30pF
• Current - Leakage (IS(off)) (Max) 20nA
• Number of Circuits 2